h2020 european project streams: general overview
| Description | |
| Date | 2018 |
| Date | |
| Auteurs | Colonna,- Jp | Savelli,- G | Royer,- A | Coudrain,- P | Keller,- M | Manoli,- Y | Frechette,- Lg | Collin,- L-m | Billat,- S | Barrau,- J | |
| Source | 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 |
| Résumé | Thermal dissipation is a major issue in microelectronics, especially for 3D circuits where the dense stacking of thin silicon layers leads to a significant increase of heat densities. In this context the H2020 European project STREAMS develops active cooling thermal management solutions for silicon interposers. The project focuses on three functionalities: versatile microfluidic actuation, precise thermal mapping, and thermal energy harvesting. The integration of those three functionalities on a silicon interposer is described with first the front-side integration of the thermoelectric functionalities and then a backside integration of the micro-channels embedding self-adaptive fins and valves. The third part presents the trade-off that had to be made between harvested energy and cooling efficiency during the integration of the different functionalities. © 2018 IEEE. |
| DOI | http://dx.doi.org/10.1109/THERMINIC.2018.8593310 |
| Type de documents | |
| Impact Factor | |